morning
im doing a project on the capacitive pressure sensor using bulk micromaching. i have the fabrication step for it . but i have the difficulty on drawing the layout on the mems pro v5.1. wer one of the process step is joining SOI wafer with glass by using epoxy ? how does i define this step ?
pls i really need some help .
TQ
regards
jo
im doing a project on the capacitive pressure sensor using bulk micromaching. i have the fabrication step for it . but i have the difficulty on drawing the layout on the mems pro v5.1. wer one of the process step is joining SOI wafer with glass by using epoxy ? how does i define this step ?
pls i really need some help .
TQ
regards
jo